The footprints on the board are interconnected using traces and vias. Irrespective of the type of component, there should be a footprint so that it can be soldered to the board at a later stage. Be it surface-mount, through-hole, or ball grid array (BGA), a land pattern is mandatory for PCB assembly. The footprint or land pattern is an arrangement of plated copper pads or through-hole plated pads on a PCB on which a component is soldered. Most of the time, the PCB footprint creation of standard packages are available in the PCB library of the design software. Only if it is not available, we will have to create one on our own referring to the datasheet of the component, while designing a circuit board. The created circuit board footprint should always match the component physical dimensions or else it will not align properly with the pads. The land pattern gives information regarding the pad sizes, the distance between the pads (pitch), component boundary and keep-out, silkscreen outlines, part numbers, reference designators, and pin numbering.
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